Comparison of Chemical Copper Plating and Electroplating

Author: Robby

Advantages and disadvantages of chemical copper plating

The advantages of chemical copper plating include:

• Wide range of substrates: copper plating can be applied to a variety of material surfaces.
• Uniform thickness of plating: can evenly cover the surface of various forms of substrates.
• Simple process equipment: does not require complex equipment, easy to operate.
• Good plating performance: good wear resistance and corrosion resistance.
• High environmental protection: less waste liquid discharge, less pollution to the environment.

Disadvantages of chemical copper plating include:

• Complex reaction: chemical copper plating reaction is complex, with many side reactions, resulting in solution maintenance and management difficulties.
• High cost: high cost due to side reactions and component loss.
• Long process flow: extremely inconvenient to operate and maintain.

Advantages and disadvantages of copper plating

The advantages of copper electroplating include:

• Fast deposition: faster deposition by the action of an applied voltage.
• Good lustre: the copper layer after plating has a lustre.
• Strong bonding of the plated layer: the plated layer has a strong bonding with the substrate.

Disadvantages of copper plating include:

• Poor environmental protection: copper plating requires additional power supply equipment and produces a large amount of waste water, waste acid and other harmful substances.