Common faults in copper sulphate electroplating process and its treatment methods

Common faults in copper sulphate electroplating process and its treatment methods

Author: Robby

The common faults in the process of electroplating copper sulphate and their treatments are as follows:

1. Rough plating:
   • Reason: plating current is large, low temperature in winter, insufficient light agent content, rework fading film plate treatment is not clean, etc..
   • Solution: lower the current, check whether the current display is normal; increase the temperature of the plating solution, replenish the content of the light agent; ensure that the reworking of the fading plate is clean.
2. Plating board surface copper particles:
   • Reason: copper sinking process, alkaline degreasing, micro-etching and other steps are not handled properly.
   • Solution: Check the steps of copper sinking, oil removal and micro-etching to ensure the quality of water quality and chemical reagents; adjust the composition of the bath and keep the bath clean.
3. High area burnt:
   • Reason: the plating solution temperature is too low, the copper content is too low, the chlorine ion is too low, the levelling agent is too much, the lack of B agent, poor mixing.
   • Solution: Increase the temperature of plating solution to 25℃; supplement the content of copper sulphate; add chlorine ion; check whether the mixing equipment works normally.
4. The plating layer seems to be mountain range pattern:
   • Reason: lack of acid copper brightening agent or chloride ion is too low.
   • Solution: replenish the vat-opening agent to 1-2ml/L; adjust the chlorine ion content to 80mg/L.
5. Degree of filling level becomes poor:
   • Reason: Lack of levelling agent A and brightener B, excessive chlorine ion.
   • Solution: replenish levelling agent A and brightener B; reduce chlorine ion content.
6. Anode passivation:
   • Reason: Sulfuric acid content is too high or too low, copper sulfate content is too high, chlorine ion is too much, iron ion is too much, anode area is too small.
   • Solution: Adjust the sulphuric acid content to 50-120g/L; control the copper sulphate content within a reasonable range; remove excess chloride ions and iron ions; make sure the anode area is sufficient.

Through the above methods, various faults encountered in the process of electroplating copper sulfate can be solved effectively to ensure the quality of electroplating and production efficiency.